<citation>
<author-group>
<name>
<surname>Chang</surname>
<given-names>SY</given-names>
</name>
<name>
<surname>Tiku </surname>
<given-names>S</given-names>
</name>
<name>
<surname>Luu</surname>
<given-names>L</given-names>
</name>
<name>
<surname>Ebrahimi</surname>
<given-names>N</given-names>
</name>
</author-group>
<year>2023</year>
<article-title>Process Optimization of Rapid Thermal Alloyed Collector Metal Layer in Compound Semiconductor Devices</article-title>
<source>NanoWorld J</source>
<volume>9</volume>
<issue>1</issue>
<fpage>23</fpage>
<lpage>28</lpage>
</citation>