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  Scopus ID: 21100926589

Effect of Surface Roughness on Diffusion Bonding of Copper with Stainless Steel

Sanoop Sebastian, Vijay Ananth Suyamburajan, Kumar Ramar and Pugazhenthi Rajagopal


In solid state diffusion bonding of copper with stainless steel, the impact of surface roughness was investigated. By polishing with various grit sizes, the surface roughness has been altered. The diffusion bonding tests were run for 30 min at 800 °C and 5 MPa. Investigations were done on the microstructure and shear strength of the diffusion bonding interface with various surface roughness. With an increase in surface finish, the shear strength has increased by more than 15%. The tensile strength was discovered to have grown up to 210 MPa. This study investigates the influence of surface roughness on the diffusion bonding process between copper and stainless steel. Through controlled experimentation, varying levels of surface roughness are examined to discern their impact on bond strength and interface morphology. The results reveal a direct correlation between surface roughness and bonding quality, with smoother surfaces exhibiting superior bond strength and more uniform interfacial characteristics. Understanding this relationship is crucial for optimizing diffusion bonding parameters and enhancing the reliability of copper-stainless steel joints in various industrial applications.

Published on: October 18, 2023
doi: 10.17756/nwj.2023-s3-089
Citation: Sebastian S, Suyamburajan VA, Ramar K, Rajagopal P. 2023. Effect of Surface Roughness on Diffusion Bonding of Copper with Stainless Steel. NanoWorld J 9(S3): S486-S489.

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